Modeling of coupled heat transfer in microchannels in OpenFOAM
https://doi.org/10.15514/ISPRAS-2022-34(5)-14
Abstract
In this paper, a numerical simulation of forced convective heat transfer in a silicon microchannel heat sink has been performed using the OpenFOAM tools. A single-phase fluid - water - was used as a heat transfer medium. The model of microchannel heat sink is represented as silicon substrate with length 10 mm, with rectangular microchannels 57 microns wide and 180 microns deep located along the full length of the heat sink. A comparative analysis in the form of cross-platform verification of the numerical results obtained with data from third-party authors was performed. The analysis of the obtained data has shown a good convergence of the study results and the possibility of using the OpenFOAM package as a computational environment for the numerical simulation of the physical processes occurring in channel radiators.
About the Authors
Elena Sergeevna Sergeevna BAIMETOVA
Kalashnikov Izhevsk State Technical University
Russian Federation
Russian Federation
Senior Lecturer at the Department of Heat Engines and Plants
Mikhail Evgenevich HVAL'KO
Kalashnikov Izhevsk State Technical University
Russian Federation
Russian Federation
Postgraduate Student
Aleksej Yurevich ARMYANIN
Kalashnikov Izhevsk State Technical University
Russian Federation
Russian Federation
Postgraduate Student
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Review
For citations:
BAIMETOVA E.S., HVAL'KO M.E., ARMYANIN A.Yu. Modeling of coupled heat transfer in microchannels in OpenFOAM. Proceedings of the Institute for System Programming of the RAS (Proceedings of ISP RAS). 2022;34(5):205-214. (In Russ.) https://doi.org/10.15514/ISPRAS-2022-34(5)-14
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